TE Connectivity Z-PACK Series Right Angle Board PCB Header, 125 Contact(s), 2 mm Pitch, 5 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 11 unités)*

340,67 €

(TVA exclue)

412,21 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 20 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +340,67 €30,97 €

*Prix donné à titre indicatif

N° de stock RS:
482-204
Référence fabricant:
5106014-1
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

Z-PACK

Pitch

2mm

Current

1.5A

Housing Material

Fibreglass Polyester

Number of Contacts

125

Number of Rows

5

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold Flash over Nickel

Termination Type

Solder

Minimum Operating Temperature

-55°C

Row Pitch

2mm

Contact Gender

Male

Maximum Operating Temperature

125°C

Tail Pin Length

3.7mm

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Distrelec Product Id

304-48-909

Pays d'origine :
CN
The TE Connectivity Hard Metric Backplane PCB Mount Header is designed to meet the demanding needs of high-speed data communication applications. With a robust construction ideal for mezzanine configurations, this component ensures a reliable connection for power and signal transmission. Its 125 positions arranged in a 25-column by 5-row design facilitate a compact design while maintaining performance integrity. Engineered to support data rates of up to 1 Gb/s, this right-angle connector utilises a 2 mm centreline for efficient space utilisation. Crafted from premium materials such as nickel and phosphor bronze, it meets stringent mechanical and signal performance standards for seamless integration in various types of PCB architectures.

Designed for use in advanced backplane communication systems

Suitable for both power and signal circuit applications

Compact design enables efficient use of space within electronic assemblies

Utilises a through-hole press-fit termination method for a secured connection

Manufactured from high-quality polyester and metal materials for durability

Operating temperature range allows for versatile application across environments

Compliant with EU RoHS and REACH regulations, ensuring environmental safety

Available in packaging quantities that facilitate flexible inventory management

Liens connexes