TE Connectivity 3-5177 Series Vertical Board PCB Header, 60 Contact(s), 0.8 mm Pitch, Shrouded

Sous-total (1 bobine de 600 unités)*

1 962,34 €

(TVA exclue)

2 374,43 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +1 962,34 €3,271 €

*Prix donné à titre indicatif

N° de stock RS:
481-713
Référence fabricant:
3-5177986-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

3-5177

Product Type

PCB Header

Pitch

0.8mm

Current

0.5A

Housing Material

Matt

Number of Contacts

60

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Brass

Contact Plating

Gold

Termination Type

Surface Mount

Row Pitch

0.8mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Standards/Approvals

No

Voltage

100 V

Distrelec Product Id

304-50-653

Pays d'origine :
CN
The TE Connectivity PCB Mount Header represents a high-quality solution for board-to-board connectivity, designed to meet the needs of contemporary electronic applications. With its vertical orientation and 60 positions, it ensures reliable performance while maintaining an efficient footprint. The fully shrouded design is crafted for secure connections, and its gold plating enhances conductivity while offering superior resistance to corrosion. Engineered for surface mount applications, this component stands out for its robustness and versatility, making it ideal for a diverse range of industries. Operating efficiently from -40 to 125 °C, it is equipped to handle demanding environments, ensuring longevity and reliability in your assemblies. Perfect for high-density applications, this header delivers exceptional signal integrity and simplifies assembly processes with its pick-and-place feature.

Durable design ensures longevity in various applications

Vertical mount orientation optimises space on the PCB

Offers a gold plating finish for enhanced conductivity

Built to withstand temperatures ranging from -40 to 125 °C

Designed for seamless integration into high-density electronic environments

Features fully shrouded headers for secure and reliable connections

Supports efficient surface mount assembly processes

Accommodates industry-standard configurations with ease

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