TE Connectivity MODII Series PCB Header, 10 Contact(s), 0.1 in Pitch, Unshrouded

Sous-total (1 plateau de 25 unités)*

234,89 €

(TVA exclue)

284,22 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +234,89 €9,396 €

*Prix donné à titre indicatif

N° de stock RS:
480-814
Référence fabricant:
1-87465-1
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Series

MODII

Product Type

PCB Header

Pitch

0.1in

Number of Contacts

10

Shrouded/Unshrouded

Unshrouded

Maximum Operating Temperature

240°C

Standards/Approvals

No

Distrelec Product Id

304-63-907

Pays d'origine :
MX
The TE Connectivity board connector is a premium-grade connectivity solution that effortlessly combines reliability with advanced design features. Crafted to meet the evolving needs of modern electrical systems, this product ensures seamless integration and enhanced performance. Its innovative construction not only adheres to stringent compliance standards but also offers exceptional durability, making it ideal for various applications across multiple industries. By utilising this product, engineers can achieve optimal functionality while maintaining compliance with critical environmental directives, assuring sustainable operations in every use case. Trust in this part to provide consistent performance, backed by comprehensive technical support and a commitment to excellence.

Designed for high-performance wire-to-board applications

Offers wave solder capability up to 240°C for versatile assembly options

BFR/CFR/PVC free, demonstrating a robust commitment to environmentally-friendly practices

Manufactured under compliance with EU RoHS and ELV directives, ensuring safety and reliability

Provides access to extensive CAD files for seamless integration into design workflows

Liens connexes