TE Connectivity AMP HPI Series Vertical Board PCB Header, 13 Contact(s), 1 mm Pitch, 1 Row, Shrouded

Sous-total (1 bobine de 1000 unités)*

1 764,12 €

(TVA exclue)

2 134,59 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s)
la bobine
Prix par unité*
1 +1 764,12 €1,764 €

*Prix donné à titre indicatif

N° de stock RS:
480-483
Référence fabricant:
1-1734595-3
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

AMP HPI

Pitch

1mm

Current

3A

Number of Contacts

13

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Nickel

Contact Material

Phosphor Bronze

Termination Type

Surface Mount

Row Pitch

1mm

Standards/Approvals

UL 94 V-0

Voltage

50 V

Distrelec Product Id

304-53-391

Pays d'origine :
TW
The TE Connectivity HPI 1.0 mm Headers series is designed to deliver reliable and efficient connections within electronic devices. Featuring a vertical PCB mount header configuration, this product excels in versatility, making it suitable for various applications where space is at a premium. Constructed from high-temperature thermoplastic and embellished with an ivory finish, this header not only ensures durability but also contributes to aesthetic appeal in modern circuit board designs. Its unique fully loaded contact load condition and ability to withstand operational voltages of up to 50 VDC commend it as a robust solution for wire-to-board connections. The thoughtful design includes features for mating alignment and retention, ensuring that the connections remain secure under typical operational conditions. Altogether, this series embodies quality, reliability, and innovation, setting a benchmark for PCB connectors.

Designed for wire to board applications enhancing connection stability

Compact dimensions facilitate integration into densely populated circuit boards

Housing material optimised for high temperature environments for increased longevity

Mating alignment features improve ease of installation reducing assembly time

Polarization options help prevent incorrect mating during installation

Matte finish on plating areas enhances conductivity and reduces wear

Liens connexes