TE Connectivity AMP HPI Series Vertical Board PCB Header, 12 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 1000 unités)*

2 695,73 €

(TVA exclue)

3 261,83 €

(TVA incluse)

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  • Expédition à partir du 16 mars 2026
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Bobine(s)
la bobine
Prix par unité*
1 +2 695,73 €2,696 €

*Prix donné à titre indicatif

N° de stock RS:
480-480
Numéro d'article Distrelec:
304-63-833
Référence fabricant:
1-1734260-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMP HPI

Product Type

PCB Header

Pitch

1.25mm

Current

3A

Number of Contacts

12

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Nickel

Termination Type

Surface Mount

Row Pitch

1.25mm

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU, UL 94V-0

Voltage

125 V

Pays d'origine :
CN
The TE Connectivity 1.25 WTB HDR SMT, 12 contact is an advanced printed circuit board connector designed to enhance the reliability of wire-to-board applications. Featuring a partially shrouded header type, this connector ensures secure connections while maintaining a compact form factor. Built for vertical mounting, the connector is ideal for space-constrained designs. The high-quality construction includes natural high-temperature thermoplastic housing and phosphor bronze contacts, ensuring durability in demanding environments. This connector supports fully loaded conditions up to 125 VDC, making it suitable for a variety of signal circuit applications. Engineered for efficiency, the product is compliant with industry standards, ensuring you receive a solution that meets your design specifications.

Engineered for vertical PCB mounting to optimize space usage

Supports robust signal applications for dependable performance

High-quality materials provide durability and longevity

Matte-finished plating enhances contact reliability

Solder peg retention ensures solid attachment to PCB

Designed for easy integration in various electronic systems

Packaging quantity of 1000 units for efficient bulk processing

Reflow solder capable, handling temperatures up to 260°C

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