TE Connectivity AMPMODU Series Right Angle Board PCB Header, 25 Contact(s), 1.27 mm Pitch, 1 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 26 unités)*

214,04 €

(TVA exclue)

258,99 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Tube(s)
le tube
Prix par unité*
1 +214,04 €8,232 €

*Prix donné à titre indicatif

N° de stock RS:
480-266
Référence fabricant:
104074-5
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3.6A

Pitch

1.27mm

Number of Contacts

25

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-53-624

Non conforme

Pays d'origine :
US
The TE Connectivity PCB Mount Header is designed for right-angle applications within board-to-board configurations, featuring an impressive 25-position layout. Built with a fully shrouded design, it ensures reliable connectivity while maintaining a compact profile. The component is well-suited for a variety of electronic devices, providing an exceptional combination of durability and performance. Its gold contact plating enhances conductivity and reduces wear over time, ensuring long-term reliability even in demanding environments. Ideal for applications requiring robust signal integrity, this header excels in both functionality and ease of use, making it an essential choice for engineers and manufacturers seeking high-quality connectivity solutions.

Designed for board to board connectivity

Fully shrouded header enhances protection against misalignment

Robust gold contact plating for superior conductivity

Right angle orientation simplifies PCB layout

High insulation resistance ensures reliability under voltage stress

Compact design optimises space utilisation on circuit boards

Suitable for a wide range of electronic applications

Wave solder capable ensuring compatibility with automated processes

Nickel underplating for added durability and performance

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