TE Connectivity AMPMODU Series Vertical Board PCB Header, 20 Contact(s), 1.27 mm Pitch, 1 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 48 unités)*

228,12 €

(TVA exclue)

276,03 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +228,12 €4,753 €

*Prix donné à titre indicatif

N° de stock RS:
478-971
Référence fabricant:
104071-4
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3.6A

Pitch

1.27mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

20

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

1.27mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Tail Pin Length

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-53-621

Non conforme

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is a cutting-edge connector designed for optimal performance in board-to-board applications. Featuring a vertical orientation and a fully shrouded design, this component ensures secure and reliable connectivity with its 20 positions and 1.27mm centreline. The use of high-quality materials, including gold-plated contacts and a robust LCP housing, guarantees longevity and consistent electrical performance, catering to the demands of modern electronic devices. It is suitable for a variety of industries and applications where signal integrity and temperature stability are crucial. With its advanced features, this connector simplifies assembly while ensuring a reliable connection, making it a must-have for any engineer’s toolkit.

Designed for secure board to board connectivity

Fully shrouded for improved protection against dust and debris

Compact 1.27mm centreline helps save precious space on PCB

Durable materials ensure long lasting performance even under high stress conditions

Nickel underplating enhances durability and conductivity

Polarization feature aids in correct mating alignment

Liens connexes