Molex 503308 Series Vertical Surface PCB Header, 50 Contact(s), 0.4 mm Pitch, 2 Row, Unshrouded

Sous-total (1 bobine de 3000 unités)*

5 827,56 €

(TVA exclue)

7 051,35 €

(TVA incluse)

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  • Expédition à partir du 19 février 2026
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Bobine(s)
la bobine
Prix par unité*
1 +5 827,56 €1,943 €

*Prix donné à titre indicatif

N° de stock RS:
478-727
Référence fabricant:
503308-5010
Fabricant:
Molex
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Marque

Molex

Series

503308

Product Type

PCB Header

Current

0.3A

Pitch

0.4mm

Number of Contacts

50

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Surface

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

0.4mm

Minimum Operating Temperature

-40°C

Termination Type

Surface Mount

Maximum Operating Temperature

85°C

Contact Gender

Male

Standards/Approvals

REACH, RoHS

Voltage

50 V

Distrelec Product Id

304-56-479

Pays d'origine :
JP
The TE Connectivity 0.40mm pitch board-to-board connector is designed for applications demanding high-density interconnection. With its dual-row vertical stacking configuration and a compact mated height of just 0.70mm, this connector effectively maximises space on printed circuit boards while ensuring reliable signal integrity. Tailored for surface mount technology, it caters to evolving electronic designs that require versatility and performance. The product stands out not only for its robust copper alloy construction but also for its low-halogen resin, ensuring environmental compliance without compromising on durability. Ideal for signal applications, this connector is your go-to solution for seamless integration in compact electronic devices.

Dual-row design optimises board space usage

Vertical stacking enhances flexibility in layout

Surface mount technology ensures easy assembly

Copper alloy construction provides superior conductivity

Low-halogen material meets stringent environmental standards

Durability with a maximum of 30 mating cycles ensures longevity

Rated for a broad temperature range of -40°C to +85°C

Compact form factor suits high-density applications

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