TE Connectivity AMPMODU Series Right Angle Board PCB Header, 16 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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Sous-total (1 plateau de 80 unités)*

222,00 €

(TVA exclue)

268,62 €

(TVA incluse)

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  • Expédition à partir du 16 mars 2026
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Prix par unité*
1 +222,00 €2,775 €

*Prix donné à titre indicatif

N° de stock RS:
478-099
Numéro d'article Distrelec:
304-50-796
Référence fabricant:
5-102570-6
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

16

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.43mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

750 Vrms

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is designed for seamless integration in wire-to-board applications, featuring a right-angle orientation for optimised space efficiency. With 16 positions and a 2.54 mm centreline, this connector is fully shrouded and crafted with high-quality materials including gold plating to ensure robust electrical performance. Its thermoplastic housing and nickel underplating provide durability and resistance to various environmental conditions, making it a versatile choice for modern electronics. This connector is compliant with key industry standards, providing peace of mind in performance and safety. Whether for automotive or general electronics, this header excels in a range of applications that demand reliability and precision.

Fully shrouded design enhances protection against misalignment

Nickel underplating increases durability and conductivity

Right angle orientation optimises PCB layout and space requirements

Compatible with multiple industry standards for expanded usability

Thermoplastic housing ensures resistance to environmental factors

Designed for board mount applications to streamline assembly

Mating alignment features simplify installation and secure connections

Solder process capability supports high-temperature soldering methods

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