TE Connectivity Micro MATE-N-LOK Series Vertical Board PCB Header, 12 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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Sous-total (1 bobine de 175 unités)*

450,94 €

(TVA exclue)

545,64 €

(TVA incluse)

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  • Expédition à partir du 16 mars 2026
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Bobine(s)
la bobine
Prix par unité*
1 +450,94 €2,577 €

*Prix donné à titre indicatif

N° de stock RS:
477-070
Numéro d'article Distrelec:
304-58-697
Référence fabricant:
4-794636-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

Micro MATE-N-LOK

Pitch

3mm

Current

5A

Number of Contacts

12

Housing Material

Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Surface Mount

Row Pitch

3mm

Maximum Operating Temperature

105°C

Mating Pin Length

4.15mm

Standards/Approvals

CNR, UL 94V-0, UL E28476, USR, VDE

Voltage

250 V

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is engineered for vertical wire-to-board applications, combining a robust design with versatility. Its 12-position configuration, featuring a precise 3 mm centreline, ensures adaptability in various electrical setups. The connector is fully shrouded to provide enhanced protection against misalignment during mating, while the surface mount design facilitates seamless integration onto printed circuit boards. Built with high-temperature nylon, this component guarantees durability and reliability across a wide operating temperature range, making it ideal for power applications. Additionally, the incorporation of tin plating enhances the longevity and overall performance of the connection, ensuring a dependable service life within demanding operational environments.

Optimised for power applications with a secure locking tab feature

Constructed from high-temperature nylon to withstand extreme conditions

Provides effective mating retention for secure connections

Features a polarisation system to prevent erroneous connections

Solder processes are capable of withstanding temperatures up to 260°C

Designed to accommodate a range of PCB thicknesses for versatile applications

Low halogen composition reflects commitment to environmental standards

Meets key industry standards for safety and compliance

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