TE Connectivity Dynamic 3000 Series Vertical Board PCB Header, 6 Contact(s), 5.08 mm Pitch, 2 Row, Shrouded

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Sous-total (1 tube de 80 unités)*

197,68 €

(TVA exclue)

239,19 €

(TVA incluse)

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  • Expédition à partir du 07 avril 2026
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Tube(s)
le tube
Prix par unité*
1 +197,68 €2,471 €

*Prix donné à titre indicatif

N° de stock RS:
476-893
Numéro d'article Distrelec:
304-51-900
Référence fabricant:
3-178140-5
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

Dynamic 3000

Current

8A

Pitch

5.08mm

Housing Material

Fibreglass Polyester

Number of Contacts

6

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Row Pitch

5.08mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

TUV, UL 94V-0

Voltage

600 V

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is an advanced interconnection solution designed for vertical wire-to-board applications. With its fully shrouded configuration and a pitch of 5.08 mm, this connector ensures reliable and secure connections, essential for powering and signaling in various industries. The product's robust design incorporates a copper alloy contact base, facilitating a high current rating, making it suitable for demanding electrical environments. In addition, the innovative housing material not only meets stringent operating temperature requirements but also guarantees longevity and operational efficiency. As part of the dynamic 3000 Series, it integrates compatibility with a wide range of terminal blocks and connectors, catering to modern electronic assemblies with effortless connectivity.

Designed for vertical PCB mounting, optimizing space utilization within your projects

Copper alloy contact base enhances conductivity and durability

Fully shrouded header ensures safety and prevents contact damage

Polarization aids in correct mating, reducing the risk of assembly errors

Wave solder capability allows for efficient manufacturing processes

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