Molex 503552 Series Vertical Surface PCB Header, 18 Contact(s), 0.4 mm Pitch, 2 Row, Unshrouded

Sous-total (1 bobine de 3000 unités)*

1 760,16 €

(TVA exclue)

2 129,79 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s)
la bobine
Prix par unité*
1 +1 760,16 €0,587 €

*Prix donné à titre indicatif

N° de stock RS:
476-513
Référence fabricant:
503552-1820
Fabricant:
Molex
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Molex

Product Type

PCB Header

Series

503552

Pitch

0.4mm

Current

0.3A

Number of Contacts

18

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

0.4mm

Termination Type

Surface Mount

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

85°C

Standards/Approvals

Low-Halogen, REACH, RoHS

Voltage

50 Vrms

Distrelec Product Id

304-56-495

Pays d'origine :
JP
The TE Connectivity 0.40mm pitch board-to-board connectors represent a sophisticated solution for modern electronics, designed to enhance connectivity and performance in compact spaces. This connector excels in applications requiring precise alignment and high-density configurations, offering remarkable reliability and ease of use. The dual-row, vertical stacking design not only saves space but also allows for efficient signal integrity, making it an ideal choice for advanced applications in various industries. With a durable mating height of 0.70mm and a robust surface mount configuration, this connector series ensures long-lasting performance, supporting up to 30 mating cycles while maintaining optimal functionality across a broad temperature range. Its superior material composition, including copper alloy with gold plating, guarantees excellent conductivity and resistance to wear, further solidifying its place as a go-to solution for board-to-board connections.

Designed for high-density configurations, ensuring optimal space utilisation

Provides reliable connectivity for advanced electronic applications

Boasts a durable mating height to withstand various operational demands

Supports an impressive number of mating cycles, enhancing longevity

Utilises high-quality materials for improved electrical performance

Facilitates efficient signal integrity across a broad temperature range

Manufactured with environmental compliance, aligning with modern standards

Liens connexes