TE Connectivity AMPMODU Series Vertical Board PCB Header, 40 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 36 unités)*

383,18 €

(TVA exclue)

463,65 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Tube(s)
le tube
Prix par unité*
1 +383,18 €10,644 €

*Prix donné à titre indicatif

N° de stock RS:
473-651
Référence fabricant:
5-104076-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

1.27mm

Current

3.6A

Housing Material

Liquid Crystal Polymer

Number of Contacts

40

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Row Pitch

1.27mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Contact Gender

Male

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-54-136

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is expertly designed for vertical board-to-board connectivity, accommodating 40 positions with a compact 1.27 mm centreline. Engineered with precision, it features a fully shrouded construction that ensures reliable performance and protection in demanding applications. The impeccable gold plating enhances contact effectiveness, making it an ideal choice for various electronic assemblies. Built to withstand high operating temperatures ranging from -65°C to 105°C, this robust connector exhibits exceptional durability, ensuring longevity in deployment. The header is a quintessential component of the AMPMODU System 50, renowned for its versatility and security in electrical connections, solidifying its place in modern electronic designs.

Compact design optimises space on printed circuit boards

Fully shrouded design guarantees enhanced safety and reliability

Nickel underplating offers superior corrosion resistance

Versatile configuration suits a wide array of applications

Wave solder capability allows for efficient assembly

Low halogen content promotes environmental responsibility

Mating dimensions ensure compatibility with a variety of connectors

Mechanical alignment features facilitate straightforward installation

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