TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

Sous-total (1 paquet de 200 unités)*

225,98 €

(TVA exclue)

273,44 €

(TVA incluse)

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  • Expédition à partir du 28 janvier 2026
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Paquet(s)
le paquet
Prix par unité*
1 +225,98 €1,13 €

*Prix donné à titre indicatif

N° de stock RS:
473-605
Référence fabricant:
5-146278-8
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Number of Contacts

8

Housing Material

Glass Filled Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Tin Plated

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.05mm

Standards/Approvals

No

Voltage

30 V

Distrelec Product Id

304-50-887

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is a cutting-edge connector designed for vertical board-to-board applications, featuring eight positions and a 2.54 mm centreline spacing. This connector excels in facilitating secure and efficient connections in various electronic assemblies, ensuring reliability and performance in demanding environments. Made from high-quality materials, the header offers excellent electrical characteristics, including a 30 VAC operating voltage. Its breakaway design not only simplifies integration but also enhances flexibility in circuit designs, making it ideal for both prototyping and production. With compatibility to both CSA and UL standards, this product represents a blend of practicality and compliance, confirming its place in innovative electronic solutions.

Connector system optimised for board-to-board configurations

Standard connector profile ensures a streamlined integration process

Designed to accommodate high temperatures with a robust housing material

Offers a through-hole solder termination method for enhanced stability

Features enhanced current ratings, ensuring reliability in demanding applications

Nickel underplating ensures improved conductivity and longevity

Breakaway design promotes easy modification and integration in various setups

Available in bulk quantities, ideal for large-scale assembly projects

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