TE Connectivity 5179031 Series Vertical Board PCB Header, 160 Contact(s), 0.8 mm Pitch, Shrouded

Sous-total (1 tube de 24 unités)*

296,23 €

(TVA exclue)

358,44 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Tube(s)
le tube
Prix par unité*
1 +296,23 €12,343 €

*Prix donné à titre indicatif

N° de stock RS:
473-569
Référence fabricant:
5179031-8
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

5179031

Current

0.5A

Pitch

0.8mm

Housing Material

Matt

Number of Contacts

160

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Brass

Contact Plating

Gold

Row Pitch

0.8mm

Termination Type

Surface Mount

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Standards/Approvals

UL 94 V-0

Voltage

100 V

Distrelec Product Id

304-50-964

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is designed for vertical, board-to-board applications, featuring a precise 160 position configuration with an 0.8 mm centreline. This fully shrouded connector is engineered for ease of use and exceptional reliability, making it suitable for various electronic assemblies. With a robust construction and high-quality materials, it ensures durability and optimal performance in diverse operating conditions. Offering surface mounting capabilities, this connector also maintains a free height, which allows for greater flexibility in circuit design. Designed with a focus on reliability and efficiency, it meets stringent electrical and mechanical standards, ensuring compatibility across a wide array of applications while facilitating seamless integration into existing systems.

PCB mount orientation enhances design flexibility

Parallel board-to-board configuration optimises space utilisation

Stackable design allows for multiple levels of connections

High surface mount capability supports advanced assembly techniques

Natural housing colour complements various PCB aesthetics

Polarisation feature improves mating accuracy

Low halogen materials support environmental compliance

Reflow solder capability simplifies manufacturing processes

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