TE Connectivity AMP Series Vertical Board PCB Header, 26 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 plateau de 40 unités)*

199,80 €

(TVA exclue)

241,76 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Prix par unité*
1 +199,80 €4,995 €

*Prix donné à titre indicatif

N° de stock RS:
472-560
Référence fabricant:
499206-6
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMP

Product Type

PCB Header

Current

1A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

26

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

2.79mm

Standards/Approvals

UL 94 V-0

Voltage

250 V

Distrelec Product Id

304-55-728

Non conforme

Pays d'origine :
CN
The TE Connectivity Advanced board-to-board connector offers seamless integration for applications requiring precision and reliability. Engineered for optimal performance, the product seamlessly accommodates a 26-position configuration with a centreline of 2.54 mm, ensuring a robust connection for various electronic devices. Its vertical orientation and through-hole soldering capability guarantee stable mounting on printed circuit boards, facilitating effortless installation. The use of high-quality materials enhances durability and operational longevity, rendering it suitable for challenging environments. Operating at up to 250 VAC and a broad temperature range of -65°C to 105°C, this connector meets the demands of diverse electronic applications while maintaining exceptional insulation resistance, making it a preferred choice for engineers.

Connector assembly type facilitates easy setup

Two-row arrangement optimizes space within devices

Mating latch and lock type provides secure connectivity

Standard connector profile contributes to versatility in design

Solder dipped process enhances solderability for longevity

Thermoplastic housing offers resilience against wear

Ejection latch mechanism supports efficient connector management

Design includes dual polarising bar for precise alignment

Compatible with a variety of connectors ensuring flexibility

Robust construction withstands harsh operating conditions

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