TE Connectivity AMPMODU Series Vertical Board PCB Header, 16 Contact(s), 2 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 700 unités)*

2 357,82 €

(TVA exclue)

2 852,96 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +2 357,82 €3,368 €

*Prix donné à titre indicatif

N° de stock RS:
472-353
Référence fabricant:
1-2307819-6
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2mm

Current

2A

Number of Contacts

16

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Surface Mount

Minimum Operating Temperature

-40°C

Row Pitch

2mm

Maximum Operating Temperature

125°C

Contact Gender

Female

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Voltage

125 V

Distrelec Product Id

304-53-455

Pays d'origine :
CN
The TE Connectivity PCB Mount Receptacle is a versatile and reliable solution for your electronic interconnection needs. Designed with a vertical orientation, this connector accommodates 16 positions, ensuring a secure and efficient board-to-board connection. Crafted with a gold (Au) finish for superior conductivity, this surface mount receptacle excels in providing seamless signal transmission for a range of applications. The compact design, featuring a standard connector profile, incorporates innovative materials such as liquid crystal polymer for enhanced durability and performance under various environmental conditions.

Engineered for board-to-board applications, enhancing connectivity options

The compact design minimises space consumption on printed circuit boards

Robust construction ensures reliable performance in high-temperature settings

Utilises gold plating to improve electrical conductivity and reduce signal loss

Tailored for surface mount technology, supporting streamlined assembly processes

Offers a dual-row layout facilitating efficient circuit design and maximising performance

Features an operating temperature range suitable for diverse environmental conditions

Incorporates nickel underplating for additional protection and longevity

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