TE Connectivity AMP-LATCH Series Vertical Cable PCB Connector, 24 Contact(s), 2.54 mm Pitch, 2 Row

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 50 unités)*

532,20 €

(TVA exclue)

643,96 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +532,20 €10,644 €

*Prix donné à titre indicatif

N° de stock RS:
472-270
Référence fabricant:
1658624-5
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Connector

Series

AMP-LATCH

Pitch

2.54mm

Current

1A

Housing Material

Thermoplastic

Number of Contacts

24

Number of Rows

2

Orientation

Vertical

Mount Type

Cable

Connector System

Wire-to-Board

Contact Plating

Gold Flash over Nickel

Contact Material

Phosphor Bronze

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

IDC

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

RoHS

Voltage

250 V

Distrelec Product Id

304-55-239

Pays d'origine :
US
The TE Connectivity wire-to-board connector is expertly designed for applications requiring reliable and efficient power and signal transmission. Featuring 24 positions and a compact 2.54 mm centreline pitch, it provides exceptional versatility for various circuit configurations. The vertical, through-hole solder receptacle offers a secure connection, ideal for both industrial and consumer electronics. Enhanced with AMP-LATCH technology, this connector ensures dependable mating, preventing accidental disconnection during operation. Built for durability, it operates effectively across a wide temperature range, making it suitable for demanding environments. Its low profile and thermoplastic housing material ensure an efficient footprint, meeting the contemporary requirements of modern circuitry while maintaining robust performance standards.

Optimised for wire-to-board applications, providing excellent connectivity

Designed for easy assembly with an efficient through-hole solder technique

Low connector profile effectively minimises space in tight enclosures

Robust construction ensures long-lasting performance in harsh conditions

Operating temperature range promotes versatility in diverse applications

Nickel underplating provides enhanced contact reliability

Mating alignment features facilitate seamless and precise connector engagement

Compatible with various wire sizes, accommodating different design needs

Liens connexes