Molex 53258 Series Vertical Board PCB Header, 15 Contact(s), 3.5 mm Pitch, 1 Row, Shrouded

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N° de stock RS:
472-129
Numéro d'article Distrelec:
304-62-631
Référence fabricant:
53258-1529
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Header

Series

53258

Current

5.5A

Pitch

3.5mm

Number of Contacts

15

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Contact Material

Brass

Contact Plating

Tin

Row Pitch

3.5mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.5mm

Standards/Approvals

EU RoHS, IPC 1752A Class D, REACH SVHC, UL E29179

Voltage

25 V

Pays d'origine :
KR
The TE Connectivity Mighty-spox header is expertly crafted for reliable wire-to-board applications. Designed to accommodate a 3.50mm pitch and 15 circuits, this vertical connector offers a robust solution for your PCB needs. With a durable brass (CuZn) contact material, it ensures long-lasting performance and compliance with various industry standards. Ideal for power applications, it supports a maximum current of 5.5A and a voltage of 250V, making it versatile for various electronic projects. Its thoughtful construction includes a fully shrouded design and a straightforward through-hole termination style, enhancing ease of use and integration into existing systems.

Designed for high-performance wire-to-board applications with a clear focus on reliability

Utilises durable brass contacts to withstand demanding operational conditions

Supports significant current and voltage ratings, making it suitable for a range of electronic applications

Fully shrouded design adds an extra layer of protection against accidental disconnections

Vertical orientation aligns well with space-constrained PCB layouts

Easy integration due to its through-hole termination style, ideal for efficient assembly

Compliant with critical industry standards, ensuring peace of mind in regulatory environments

Low weight contributes to the overall efficiency of the assembly process

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