TE Connectivity AMPMODU Series Vertical Board PCB Header, 6 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Sous-total (1 plateau de 232 unités)*

396,77 €

(TVA exclue)

480,09 €

(TVA incluse)

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  • Expédition à partir du 12 octobre 2026
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Prix par unité*
1 +396,77 €1,71 €

*Prix donné à titre indicatif

N° de stock RS:
470-993
Référence fabricant:
103168-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

6

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

750 Vrms

Distrelec Product Id

304-51-490

Non conforme

Pays d'origine :
US
The TE Connectivity PCB mount header offers a robust and reliable solution for vertical, board-to-board connections, bringing together six positions in a fully shrouded design. Crafted with precision, it features a 2.54 mm centreline, ensuring compatibility with a wide range of applications. Designed with gold-plated contacts for superior conductivity, this connector provides secure, solder-based terminations and is engineered to withstand operational conditions typical in electronic environments. Ideal for high-density assemblies, it boasts a compact footprint without compromising mechanical integrity or performance. Its reliable operation under extreme temperatures ensures steadfast performance in mission-critical applications.

Optimised for space saving designs while maintaining performance

Engineered for high reliability in demanding environments

Gold plating ensures excellent electrical conductivity

Fully loaded configuration supports multiple connections

Thermoplastic housing offers enhanced durability

Detent window feature maximises mating retention

Designed for wave solder capability streamlining assembly

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