TE Connectivity LUMAWISE Series Vertical Board PCB Header, 4 Contact(s), 1.5 mm Pitch, 1 Row

Sous-total (1 bobine de 450 unités)*

611,21 €

(TVA exclue)

739,56 €

(TVA incluse)

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  • Expédition à partir du 28 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +611,21 €1,358 €

*Prix donné à titre indicatif

N° de stock RS:
470-589
Référence fabricant:
2106091-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

LUMAWISE

Product Type

PCB Header

Current

3A

Pitch

1.5mm

Number of Contacts

4

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

30°C

Termination Type

Surface Mount

Row Pitch

1.5mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

China RoHS 2, CSA, CSA/C22.2 No. 182.3-M1987, EU ELV, EU REACH, EU RoHS, UL, UL 1977, UL 94V-0, UL E28476

Mating Pin Length

2.4mm

Voltage

50 V

Distrelec Product Id

304-53-876

Pays d'origine :
US
The TE Connectivity Inverted thru-board interconnect is designed with precision for optimal reliability in PCB applications. This product boasts a vertical orientation and is engineered specifically for wire-to-board connectivity with a compact 1.5 mm centreline. Ideal for both industrial and consumer electronics, the natural colour and surface mount design ensures it seamlessly integrates into various PCB layouts while providing a sturdy connection for signalling applications. With its robust construction and thoughtful features, this connector aims to meet the demands of modern electronic systems, guaranteeing performance and durability under diverse operating conditions.

Utilises surface mount technology for easy integration onto PCBs

Offers a compact design that saves space in tight layouts

Features a durable housing material for enhanced component longevity

Maintains a consistent electrical performance even under high temperatures

Includes contact underplating for improved conductivity and reliability

Incorporates a mating alignment feature to ensure secure connections

Designed with a polarisation mechanism to prevent incorrect mating

Packaged in bulk quantities to accommodate large production needs

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