TE Connectivity AMPMODU Series Vertical PCB PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

Sous-total (1 paquet de 150 unités)*

401,38 €

(TVA exclue)

485,67 €

(TVA incluse)

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  • Expédition à partir du 24 février 2026
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le paquet
Prix par unité*
1 +401,38 €2,676 €

*Prix donné à titre indicatif

N° de stock RS:
468-350
Numéro d'article Distrelec:
304-53-926
Référence fabricant:
281696-8
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

8

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Minimum Operating Temperature

-55°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

125°C

Tail Pin Length

2.9mm

Contact Gender

Male

Mating Pin Length

7mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

1000 V

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is designed for vertical wire-to-board applications, accommodating 8 positions with precision engineered 2.54 mm centreline spacing. Its partially shrouded design enhances safety and connectivity, making it an excellent choice for various electronic projects. Crafted from high-quality materials including high-temperature thermoplastic and phosphor bronze, this connector ensures durability and reliability even under challenging environmental conditions. The header features gold-plated contact mating areas, providing optimal conductivity and corrosion resistance. Perfectly suited for both industrial and commercial use, this component simplifies connections while maintaining optimal performance in demanding situations.

Vertical orientation optimises space on the PCB for compact designs

Mating alignment ensures easier connection and reliability

Rated for a maximum current of 3 A suitable for various applications

Wave solder capability allows for efficient assembly processes

Insulation resistance rated at 5000 MOhm ensuring enhanced reliability

Fully loaded contact load conditions maintain optimal performance

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