TE Connectivity AMP HPI Series Vertical Board PCB Header, 14 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded

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218,35 €

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264,20 €

(TVA incluse)

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1 +218,35 €1,092 €

*Prix donné à titre indicatif

N° de stock RS:
467-906
Numéro d'article Distrelec:
304-53-493
Référence fabricant:
1-440052-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMP HPI

Pitch

2.5mm

Current

3A

Housing Material

Polyamide 66 Fibreglass

Number of Contacts

14

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Brass

Minimum Operating Temperature

-25°C

Row Pitch

2.5mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

85°C

Tail Pin Length

3.4mm

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, UL 94V-0

Mating Pin Length

3.45mm

Voltage

250 V

Pays d'origine :
CN
The TE Connectivity PCB mount header delivers reliable performance for a range of wire-to-board applications. Designed with a vertical orientation and featuring 14 positions, it is optimised for compact environments. The component's partially shrouded design enhances safety while permitting easy access for soldering. Constructed from durable materials, it ensures long-lasting functionality and optimal electrical connectivity. Operating effectively within a broad temperature range, this connector is equipped to handle demanding circuit applications, reinforcing its versatility in various electronic designs. Its compatibility with standard PCB thicknesses allows for simple integration into existing systems, making it an ideal choice for both new projects and upgrades.

Utilises a 2.5 mm centreline for modular design flexibility

Provides reliable signal integrity for demanding applications

Constructed from robust nylon 66 GF for enhanced durability

Incorporates kinked tines for dependable PCB mount retention

Features bright tin plating for improved conductivity and corrosion resistance

Supports wave solder processes for efficient manufacturing

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