TE Connectivity AMPMODU Series Vertical Board PCB Header, 20 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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N° de stock RS:
467-874
Numéro d'article Distrelec:
304-53-534
Référence fabricant:
1-535585-0
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

2A

Pitch

2.54mm

Number of Contacts

20

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Contact Gender

Female

Tail Pin Length

3.18mm

Maximum Operating Temperature

125°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

333V

Non conforme

Pays d'origine :
TW
The TE Connectivity PCB Mount Receptacle is a premium solution designed for vertical, board-to-board applications, featuring a robust 20-position array that ensures reliable connections. This connector is meticulously engineered to accommodate standardised 2.54 mm centreline spacing, making it an ideal choice for various circuit applications. Characterised by its through-hole solder termination, it guarantees secure mounting on printed circuit boards. With a low connector profile and a sleek black finish, this component not only performs efficiently but also integrates seamlessly into a variety of electronic designs. The product is crafted from high-quality thermoplastic housing material, ensuring durability under demanding conditions, while the impressive voltage and insulation specifications enhance its reliability in performance-critical environments.

Designed for easy integration into PCB layouts

Vertical orientation simplifies board stacking

Sealable construction protects against dust and moisture

Compatible with the Modu Connector System for versatile applications

Optimised for signal circuit applications, ensuring minimal interference

Allows for high operating temperature ranges, accommodating various environmental factors

Utilises a closed entry housing design for secure contact protection

Solder process capability supports various soldering techniques

Offers a stack height designed for space-efficient configurations

Meets industry standards for exceptional compatibility and safety

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