TE Connectivity AMP CT Series Vertical Surface PCB Header, 120 Contact(s), 0.8 mm Pitch, 1 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 550 unités)*

4 913,34 €

(TVA exclue)

5 945,14 €

(TVA incluse)

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  • Expédition à partir du 24 février 2026
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Bobine(s)
la bobine
Prix par unité*
1 +4 913,34 €8,933 €

*Prix donné à titre indicatif

N° de stock RS:
467-219
Numéro d'article Distrelec:
304-50-117
Référence fabricant:
1-5177986-5
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMP CT

Product Type

PCB Header

Current

0.5A

Pitch

0.8mm

Number of Contacts

120

Housing Material

Matt

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Board-to-Board

Contact Material

Brass

Contact Plating

Gold

Termination Type

Surface Mount

Row Pitch

0.8mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Standards/Approvals

No

Voltage

100 V

Pays d'origine :
CN
The TE Connectivity PCB mount header offers a robust solution for board-to-board connectivity, designed for applications requiring precision and reliability. Engineered with a fully shrouded architecture, it boasts an impressive 120-position configuration, ensuring seamless integration within compact electronic assemblies. The 0.8 mm centreline pitch further optimises space utilisation, catering to contemporary design needs. Supporting operating voltages of up to 100 VAC, this connector guarantees performance across demanding environments. Its surface mount design simplifies installation, whilst the high-quality materials ensure long-lasting durability. With features like gold plating and a strong brass contact base, this product delivers exceptional electrical performance and resilience. Ideal for a variety of applications, including signal and data transfer, this connector sets a standard in excellence.

Features fully shrouded protection to enhance durability and reliability

Designed for seamless board-to-board connections with precise alignment

Utilises a compact 0.8 mm pitch to maximise board space efficiency

Constructed with high-quality brass contacts for superior conductivity

Gold plating ensures excellent corrosion resistance and long-term performance

Surface mount technology simplifies assembly processes and reduces footprint

Capable of withstanding harsh environmental conditions, ensuring longevity

Compatible with high-speed signals to support advanced electronic applications

Facilitates easy integration into existing systems with versatile mounting options

Offers stacking capability for flexible design configurations

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