TE Connectivity Economy Power 2.5 Series Vertical Board PCB Header, 60 Contact(s), 0.5 mm Pitch, 1 Row, Shrouded

Sous-total (1 bobine de 1000 unités)*

3 728,19 €

(TVA exclue)

4 511,11 €

(TVA incluse)

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  • Expédition à partir du 27 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +3 728,19 €3,728 €

*Prix donné à titre indicatif

N° de stock RS:
467-212
Référence fabricant:
1565357-5
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

Economy Power 2.5

Current

0.5A

Pitch

0.5mm

Housing Material

High Heat-Resisted Resin

Number of Contacts

60

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

30°C

Termination Type

Surface Mount

Row Pitch

0.5mm

Contact Gender

Female

Maximum Operating Temperature

105°C

Standards/Approvals

UL 94 V-0

Voltage

250 V

Distrelec Product Id

304-53-684

Pays d'origine :
JP
The TE Connectivity PCB Mount Receptacle is designed for vertical, board-to-board applications, offering exceptional performance with 60 positions and a compact 0.5 mm centreline. Constructed with high-quality materials, it ensures reliable signal transmission and robust connections. The gold plating on the contact mating area enhances conductivity and resistance to corrosion, making it ideal for demanding electrical environments. With a temperature range suitable for operation between -30°C and 105°C, this connector is engineered to perform efficiently across a broad spectrum of applications. Its surface mount design simplifies integration into printed circuit boards, while the thoughtful engineering allows for stackable configurations, providing flexibility in design. This component represents a fusion of precision engineering and practical utility, making it an excellent choice for your connector needs.

Designed for vertical PCB mounting, enhancing ease of installation

Offers 60 positions, facilitating a compact connection layout

Constructed from high heat-resisted resin for durability in challenging environments

Gold plating ensures superior conductivity and long-lasting performance

Compatible with a wide range of applications due to its versatile design

Reflow solder capable, maximising compatibility with modern manufacturing processes

Supports a broad operating temperature range, ensuring reliability across varying conditions

Stackable design provides flexibility for space-constrained setups

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