TE Connectivity AMPMODU Series Vertical Board PCB Header, 20 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 250 unités)*

1 273,54 €

(TVA exclue)

1 540,98 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +1 273,54 €5,094 €

*Prix donné à titre indicatif

N° de stock RS:
467-171
Référence fabricant:
2-1825601-0
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3.6A

Pitch

1.27mm

Number of Contacts

20

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Termination Type

Surface Mount

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Distrelec Product Id

304-53-788

Pays d'origine :
MX
The TE Connectivity PCB Mount Header offers a sophisticated solution for board-to-board applications. Designed with a 20-position configuration and a 1.27 mm centreline, it ensures effective signal transmission while maintaining a compact form factor. The fully shrouded design and gold (Au) plating enhance durability and conductivity, making it suitable for demanding environments. Its vertical orientation facilitates straightforward integration into various PCB layouts, contributing to efficient space management. The housing material is LCP, reflecting advanced thermal and mechanical properties, while the product's robust construction supports a temperature range of -65°C to 105°C. Compliant with industry standards, this connector assembly is an excellent choice for reliable performance in projects across diverse sectors.

Optimised for board-to-board connectivity with a fully shrouded header type

Compact design promotes efficient space utilisation in electronic assemblies

Gold plating ensures superior conductivity and enhanced corrosion resistance

Designed for high-reliability applications with polarisation for accurate mating

High-temperature rating supports demanding operational conditions

Conforms to strict environmental regulations for sustainable use

Versatile termination method allows for quick and reliable surface mount processes

Low halogen content aids in compliance with green manufacturing initiatives

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