STMicroelectronics 3-Axis Surface Accelerometer & Gyroscope 3.6 V 1.71 V, I2C/SPI, LGA-14L, 14-Pin

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Sous-total (1 bobine de 5000 unités)*

22 680,00 €

(TVA exclue)

27 445,00 €

(TVA incluse)

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  • Expédition à partir du 24 décembre 2026
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Unité
Prix par unité
la bobine*
5000 - 50004,536 €22 680,00 €
10000 - 100004,418 €22 090,00 €
15000 +4,309 €21 545,00 €

*Prix donné à titre indicatif

N° de stock RS:
261-4176
Référence fabricant:
ISM330ISTR
Fabricant:
STMicroelectronics
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Marque

STMicroelectronics

Product Type

Accelerometer & Gyroscope

Sensor Type

Accelerometer, Gyroscope

Number of Axis

3

Technology

Accelerometer

Mount Type

Surface

Interface Type

I2C/SPI

Magnetic Type

Latch

Minimum Supply Voltage

3.6V

Package Type

LGA-14L

Maximum Supply Voltage

1.71V

Minimum Operating Temperature

-40°C

Pin Count

14

Maximum Operating Temperature

85°C

Series

ISM330IS

Height

0.86mm

Length

2.5mm

Standards/Approvals

RoHS

Width

3 mm

Automotive Standard

No

Pays d'origine :
PH

iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with embedded ISPU - intelligent sensor processing unit


The ISM330IS is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in industrial and IoT solutions.

The ISM330IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

The ISM330IS features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.

The ISM330IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the edge. The main benefits of the ISPU are C programming and an enhanced ecosystem with libraries and 3rd party tools/IDE.

Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node from small equipment or accessories to enterprise solutions for Industry 5.0 (for example, anomaly detection, asset tracking, factory automation, and so forth).

The ISM330IS is available in a plastic land grid array (LGA) package.

Key features


  • 3-axis accelerometer with selectable full scale: ±2/±4/±8/±16 g

  • 3-axis gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps

  • Embedded ISPU: ultra-low-power, high-performance programmable core to execute signal processing and AI algorithms in the edge for a seamless digital-life experience

  • Low-power consumption: 0.59 mA in high-performance mode, 0.46 mA in low-power mode (gyroscope + accelerometer only, ISPU not included)

  • Low noise: 70 μg/√Hz in high-performance mode

  • Sensor hub feature to efficiently collect data from additional external sensors (up to 4 external sensors)

  • SPI / I²C serial interface

  • Analog supply voltage: 1.71 V to 3.6 V with independent IO supply (1.62 V)

  • Temperature range from -40 to +85 °C

  • Embedded temperature sensor

  • Compact footprint: 2.5 mm x 3 mm x 0.83 mm

  • ECOPACK and RoHS compliant

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