Références fabricant

STMicroelectronics 3 Axis Surface Sensor 1.71 V 3.6V, Serial-I2C, Serial-SPI, LGA, 14-Pin

N° de stock RS:: 162-3641P
Référence fabricant:: ISM330DLCTR
Fabricant:: STMicroelectronics

STMicroelectronics 3 Axis Surface Sensor 1.71 V 3.6V, Serial-I2C, Serial-SPI, LGA, 14-Pin

Actuellement indisponible

Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.

N° de stock RS:: 162-3641P
Référence fabricant:: ISM330DLCTR
Fabricant:: STMicroelectronics

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Détails du produit

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Sélectionner tout	Attribut	Valeur
	Marque	STMicroelectronics
	Sensor Type	Accelerometer, Gyroscope
	Product Type	Sensor
	Number of Axis	3
	Technology	Digital, Analogue
	Mount Type	Surface
	Interface Type	Serial-I2C, Serial-SPI
	Maximum Frequency Response	400kHz
	Minimum Frequency Response	0kHz
	Minimum Supply Voltage	1.71V
	Maximum Supply Voltage	3.6V
	Package Type	LGA
	Minimum Operating Temperature	-40°C
	Sensitivity	0.49mg/LSB
	Pin Count	14
	Maximum Operating Temperature	85°C
	Height	0.83mm
	Length	2.5mm
	Series	ISM330DLC
	Width	3mm
	Standards/Approvals	No
	Supply Current	0.75mA
	Automotive Standard	No

	Sélectionner tout
	Marque STMicroelectronics
	Sensor Type Accelerometer, Gyroscope
	Product Type Sensor
	Number of Axis 3
	Technology Digital, Analogue
	Mount Type Surface
	Interface Type Serial-I2C, Serial-SPI
	Maximum Frequency Response 400kHz
	Minimum Frequency Response 0kHz
	Minimum Supply Voltage 1.71V
	Maximum Supply Voltage 3.6V
	Package Type LGA
	Minimum Operating Temperature -40°C
	Sensitivity 0.49mg/LSB
	Pin Count 14
	Maximum Operating Temperature 85°C
	Height 0.83mm
	Length 2.5mm
	Series ISM330DLC
	Width 3mm
	Standards/Approvals No
	Supply Current 0.75mA
	Automotive Standard No

1623602_DataSheet 1

The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

3D accelerometer with selectable full scale

3D gyroscope with selectable full scale

Dedicated gyroscope output chain with low latency, low noise and dedicated low-pass filters

Embedded hard, soft ironing for external magnetic sensor corrections

Embedded temperature sensor

High shock survivability

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