Infineon TC233LP32F200NACKXUMA1, 32 bit TriCore, TriCore Microcontroller, 200 MHz, 2.048MB FLASH, 100-Pin TQFP

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Sous-total (1 bobine de 1000 unités)*

10 764,00 €

(TVA exclue)

13 024,00 €

(TVA incluse)

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  • Expédition à partir du 10 juin 2027
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Prix par unité
la bobine*
1000 - 100010,764 €10 764,00 €
2000 - 200010,488 €10 488,00 €
3000 +10,226 €10 226,00 €

*Prix donné à titre indicatif

N° de stock RS:
229-1878
Référence fabricant:
TC233LP32F200NACKXUMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

Microcontroller

Series

TriCore

Package Type

TQFP

Mount Type

Surface

Pin Count

100

Device Core

TriCore

Data Bus Width

32bit

Interface Type

LIN, CAN, SPI

Program Memory Size

2.048MB

Maximum Clock Frequency

200MHz

RAM Size

192kB

Maximum Supply Voltage

3.3V

Minimum Operating Temperature

-40°C

Maximum Power Dissipation Pd

460mW

Maximum Operating Temperature

125°C

Width

14mm

Standards/Approvals

ISO 26262, AUTOSAR V3.2 and V4.x

Height

1.2mm

Length

14mm

Minimum Supply Voltage

0mV

Number of Timers

1

ADCs

24 x 12 Bit

Automotive Standard

ISO 26262

Program Memory Type

FLASH

Infineon AURIXTM Series Microcontroller, 200MHz Maximum Clock Frequency, 2MB Program Memory Size - TC233LP32F200NACKXUMA1


This microcontroller is a surface-mount, automotive-grade processing device designed for vehicle electronics and control systems. It combines a 32-bit TriCore core with flash programme memory and multiple vehicle communication interfaces to support safety-aware embedded applications operating across a wide temperature range.

Features and Benefits:


• 200MHz core delivers deterministic execution for real-time control
• 2MB flash programme memory enables extensive firmware storage
• 192kB RAM supports complex runtime data and buffering
• LIN CAN SPI interfaces facilitate multi-network communications
• 24x12bit ADC channels provide fine-grained analogue sampling
• 460mW maximum dissipation reduces thermal load in assemblies

Applications


• Suitable for domain controllers requiring functional safety
• Ideal for powertrain and body control modules with vehicle networks
• Used for data acquisition tasks utilising multiple ADC channels
• Can be used in systems requiring AUTOSAR compliance support
• Used with designs needing operation from -40 to125°C

What package type does it use for PCB assembly?


It is supplied in a 100-pin TQFP surface-mount package suitable for SMT assembly.

Which supply voltage and bus width does it require?


It operates at up to 3.3V and employs a 32-bit data bus architecture.

What timers and peripheral resources are available?


The device includes one hardware timer alongside serial interfaces and ADCs for timing and I/O needs.

How does it meet automotive software integration standards?


It conforms to AUTOSAR V3.2 and V4.x profiles for compatible software stacks.

What operational temperature and power constraints should be considered?


It is specified for use between -40 and125°C with a maximum power dissipation of 460mW.

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