Amphenol Communications Solutions 0.5 mm Pitch 262 Way, Right Angle Surface Mount DDR5 DIMM Socket ,250V ac, 500mA
- N° de stock RS:
- 263-3697
- Référence fabricant:
- 10162981-002RHLF
- Fabricant:
- Amphenol Communications Solutions
Actuellement indisponible
Désolés, nous ne savons pas quand ce produit sera réapprovisionné.
- N° de stock RS:
- 263-3697
- Référence fabricant:
- 10162981-002RHLF
- Fabricant:
- Amphenol Communications Solutions
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Amphenol Communications Solutions | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DIMM | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Latched | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 262 | |
| Pitch | 0.5mm | |
| Mount Type | Surface | |
| Housing Material | Liquid Crystal Polymer | |
| SDRAM Type | DDR5 | |
| Minimum Operating Temperature | -40°C | |
| Latching | Yes | |
| Maximum Operating Temperature | 85°C | |
| Maximum Contact Resistance | 1mΩ | |
| Standards/Approvals | RoHS | |
| Series | 10162981 | |
| Voltage | 250V ac | |
| Sélectionner tout | ||
|---|---|---|
Marque Amphenol Communications Solutions | ||
Product Type DIMM Socket | ||
Memory Socket Type DIMM | ||
Orientation Right Angle | ||
Insertion/Removal Method Latched | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 262 | ||
Pitch 0.5mm | ||
Mount Type Surface | ||
Housing Material Liquid Crystal Polymer | ||
SDRAM Type DDR5 | ||
Minimum Operating Temperature -40°C | ||
Latching Yes | ||
Maximum Operating Temperature 85°C | ||
Maximum Contact Resistance 1mΩ | ||
Standards/Approvals RoHS | ||
Series 10162981 | ||
Voltage 250V ac | ||
- Pays d'origine :
- CN
The Amphenol DDR5 SO-DIMM connectors deliver high speed and bandwidth. Being half the size of regular DIMMs, it consume lower power and promote better thermal management.
Withstands high temperature IR flow
LCP, halogen free, housing material
Liens connexes
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