TE Connectivity 1 mm Pitch 240 Way, Vertical Board Mount DDR3 DIMM Socket ,1.5V, 750mA
- N° de stock RS:
- 480-038
- Numéro d'article Distrelec:
- 304-62-857
- Référence fabricant:
- 1-1932000-0
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 50 unités)*
195,74 €
(TVA exclue)
236,85 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 02 juillet 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 195,74 € | 3,915 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 480-038
- Numéro d'article Distrelec:
- 304-62-857
- Référence fabricant:
- 1-1932000-0
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Insertion/Removal Method | Direct Insert | |
| Orientation | Vertical | |
| Current | 750mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 240 | |
| Pitch | 1mm | |
| Mount Type | Board | |
| Housing Material | Nylon | |
| SDRAM Type | DDR3 | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Row Spacing | 1.9mm | |
| Maximum Operating Temperature | 155°C | |
| Standards/Approvals | EU RoHS Directive 2011/65/EU Compliant, 2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, UL 94V-0 | |
| Series | DDR3 DIMM | |
| Voltage | 1.5V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Insertion/Removal Method Direct Insert | ||
Orientation Vertical | ||
Current 750mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 240 | ||
Pitch 1mm | ||
Mount Type Board | ||
Housing Material Nylon | ||
SDRAM Type DDR3 | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Row Spacing 1.9mm | ||
Maximum Operating Temperature 155°C | ||
Standards/Approvals EU RoHS Directive 2011/65/EU Compliant, 2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, UL 94V-0 | ||
Series DDR3 DIMM | ||
Voltage 1.5V | ||
- Pays d'origine :
- CN
The TE Connectivity Double Data Rate (DDR) 3 Board-to-Board socket is engineered for superior performance in memory applications. Designed with 240 positions, it adeptly facilitates seamless connectivity under various operational conditions. Its vertical module orientation optimises space on the PCB, while the through-hole solder termination assures reliable and robust mounting. Crafted with high-temperature nylon, this socket boasts impressive durability and resilience. The innovative design supports a wide operating temperature range, making it suitable for diverse applications. Whether you are working on consumer electronics or complex computing systems, this socket guarantees consistent signal integrity and high-performance standards.
Offers a robust connection for DDR applications
Facilitates efficient board to board communication
Designed to withstand extreme temperature variations
Constructed from high quality materials for enhanced longevity
Supports easy insertion with direct insert methodology
Optimises space utilisation on printed circuit boards
Features a natural latch colour for aesthetic integration
Includes a range of compatible parts for versatile application
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