Molex, 500901 8 Way Right Angle Hinged MicroSD Memory Card Connector, Solder
- N° de stock RS:
- 670-2430P
- Référence fabricant:
- 500901-0801
- Fabricant:
- Molex
Offre groupée disponible
Consulter les options de prix de grosSous-total 25 unités (conditionné en bande continue)*
66,50 €
(TVA exclue)
80,50 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
En stock
- 35 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
- Plus 1 400 unité(s) expédiée(s) à partir du 26 octobre 2026
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Unité | Prix par unité |
|---|---|
| 25 - 74 | 2,66 € |
| 75 - 199 | 2,36 € |
| 200 - 399 | 2,27 € |
| 400 + | 2,18 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 670-2430P
- Référence fabricant:
- 500901-0801
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Product Type | Memory Card Connector | |
| Card Type | MicroSD | |
| Gender | Male | |
| Insertion/Removal Method | Hinged | |
| Number of Contacts | 8 | |
| Number of Rows | 1 | |
| Pitch | 1.1mm | |
| Orientation | Right Angle | |
| Mount Type | Surface | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold over Nickel | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -25°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| Series | 500901 | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Product Type Memory Card Connector | ||
Card Type MicroSD | ||
Gender Male | ||
Insertion/Removal Method Hinged | ||
Number of Contacts 8 | ||
Number of Rows 1 | ||
Pitch 1.1mm | ||
Orientation Right Angle | ||
Mount Type Surface | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold over Nickel | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Minimum Operating Temperature -25°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
Series 500901 | ||
Molex 500901 Series Memory Card Connector, 1.1mm Pitch, 8 Contacts - 500901-0801
This is a microSD memory card connector designed for efficient and reliable connections in various applications. With a unique hinged design and compact dimensions of 14.6 x 1.93 x 14.5mm, it is specifically engineered for use with MicroSD cards. The right-angle orientation facilitates seamless integration into electronic devices while maintaining a space-saving profile.
Features & Benefits
• Hinged design allows for easy insertion and removal of cards
• Compatible with surface mount technology for efficient assembly
• Right-angle configuration optimises space in compact applications
• Constructed from copper alloy with gold plating for enhanced conductivity
• High-performance alloy housing ensures durability at high temperatures
• 8 contact arrangement supports robust data transmission
Applications
• Utilised in handheld devices for memory expansion
• Employed in automotive solutions requiring reliable memory interfaces
• Integrated into consumer electronics for data storage functions
• Suitable for industrial automation systems demanding compact connectors
Can the connector withstand extreme environmental conditions?
This connector operates within a temperature range of -25°C to +85°C, making it suitable for use in both low and high-temperature environments.
What is the maximum current capacity for each contact?
It can handle a maximum of 0.5A per contact, ensuring efficient power transfer while maintaining safe operating limits.
How many mating cycles can be expected from this connector?
The design supports up to 1,000 mating cycles, providing longevity and reliability in various applications.
Does it provide any form of retention for the PCB?
Yes, the connector features PCB retention capabilities, ensuring secure mounting during operation.
What materials are used in the construction of this connector?
It is constructed from stainless steel for the housing and high-temperature thermoplastic for the resin, ensuring both strength and thermal resistance.