TE Connectivity, 1-2069 Memory Card Connector, Solder
- N° de stock RS:
- 471-873
- Numéro d'article Distrelec:
- 304-62-864
- Référence fabricant:
- 1-2069838-3
- Fabricant:
- TE Connectivity
Sous-total (25 unités, dans un plateau de 25)*
215,99 €
(TVA exclue)
261,35 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 03 novembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 215,99 € | 8,64 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 471-873
- Numéro d'article Distrelec:
- 304-62-864
- Référence fabricant:
- 1-2069838-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | Memory Card Connector | |
| Number of Rows | 1 | |
| Pitch | 2.5mm | |
| Orientation | Straight | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU RoHS 2011/65/EU, 2016, China RoHS 2 MIIT Order No 32, EU REACH (EC) No. 1907/2006, EU ELV 2000/53/EC | |
| Series | 1-2069 | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type Memory Card Connector | ||
Number of Rows 1 | ||
Pitch 2.5mm | ||
Orientation Straight | ||
Termination Type Solder | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU RoHS 2011/65/EU, 2016, China RoHS 2 MIIT Order No 32, EU REACH (EC) No. 1907/2006, EU ELV 2000/53/EC | ||
Series 1-2069 | ||
- Pays d'origine :
- US
The TE Connectivity product represents cutting-edge engineering with its LGA115X design, ideal for applications requiring reliable thermal interfaces. Positioned as a fundamental component in high-performance computing systems, it enhances both thermal efficiency and reliability. Constructed with meticulous attention to detail, this solution ensures compatibility across various systems while simplifying the installation process. The innovative design caters to the evolving demands of technology, making it a robust choice for both advanced users and general consumers alike.
Optimized for effective thermal management within compact environments
Designed to integrate seamlessly with modern computing systems
Facilitates straightforward installation for users of all levels
Resilient build quality ensures longevity and reliability in performance
Enhances system efficiency through advanced engineering techniques
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