TE Connectivity 989 Way PGA Surface rPGA IC Socket
- N° de stock RS:
- 474-390
- Numéro d'article Distrelec:
- 304-59-436
- Référence fabricant:
- 2013620-3
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 120 unités)*
1 702,03 €
(TVA exclue)
2 059,46 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 18 mai 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 702,03 € | 14,184 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 474-390
- Numéro d'article Distrelec:
- 304-59-436
- Référence fabricant:
- 2013620-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Package Type | PGA | |
| Product Type | IC Socket | |
| IC Socket Type | rPGA | |
| Number of Contacts | 989 | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Socket Mount Type | Surface | |
| Termination Type | Surface Mount | |
| Standards/Approvals | UL 94 V-0 | |
| Series | Alcoswitch PKA | |
| Housing Material | High Temperature Thermoplastic | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Package Type PGA | ||
Product Type IC Socket | ||
IC Socket Type rPGA | ||
Number of Contacts 989 | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Socket Mount Type Surface | ||
Termination Type Surface Mount | ||
Standards/Approvals UL 94 V-0 | ||
Series Alcoswitch PKA | ||
Housing Material High Temperature Thermoplastic | ||
- Pays d'origine :
- CN
The TE Connectivity Socket assembly is engineered for high-performance applications demanding utmost reliability. This socket assembly features a pin grid array configuration designed specifically for rPGA processors, ensuring seamless integration into various electronic systems. Constructed with a combination of high-temperature thermoplastic and advanced plating materials, it provides robust performance in challenging environments. The thoughtful design includes a low-profile connector, making it ideal for space-constrained applications. Its precision engineering supports optimal contact mating for electrical integrity, whilst maintaining ease of assembly with a pick-and-place cover and tape feature. This product meets multiple industry standards, ensuring compliance and adaptability across a wide range of devices.
Pin grid array configuration for rPGA processors enhances compatibility
Constructed from high-temperature thermoplastic for durability
Gold plating on contacts maximises electrical performance
Designed for surface mount termination, facilitating efficient PCB integration
Low profile design is perfect for compact assemblies
Supports robust reflow solder processes up to 260°C
Includes a pick-and-place cover for effortless installation
UL 94V-0 rating ensures safety and reliability in various applications
Low halogen materials contribute to environmental safety
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