Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 83 mm 200 mm 80 mm
- N° de stock RS:
- 692-0641
- Numéro d'article Distrelec:
- 304-11-272
- Référence fabricant:
- LA 9 200 24 V
- Fabricant:
- Fischer Elektronik
Sous-total (1 unité)*
389,64 €
(TVA exclue)
471,46 €
(TVA incluse)
Ajouter 1 unité pour bénéficier d'une livraison gratuite
- 15 unité(s) prête(s) à être expédiée(s)
Unité | Prix par unité |
|---|---|
| 1 - 1 | 389,64 € |
| 2 - 4 | 377,99 € |
| 5 - 9 | 370,15 € |
| 10 + | 358,48 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 692-0641
- Numéro d'article Distrelec:
- 304-11-272
- Référence fabricant:
- LA 9 200 24 V
- Fabricant:
- Fischer Elektronik
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Rectangular Alu with Fan | |
| Length | 200mm | |
| Width | 80 mm | |
| Height | 83mm | |
| Finish | Black Anodised | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Cooling | |
| Special Features | Particularly Effective Heat Dissipation, Two Opposite Mounting Surfaces Are Milled Flat, Only Effective With Forced Ventilation by Means of the Fan but Not With Free Convection, Geometry of Hollow Fin Optimizing the Air Flow, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Compact Design With Axial Fan, With Air Flow Chamber, High Performance Density Due to Large Heat-Conducting Surfaces, Semiconductor Mounting Surface for Milled Flat, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Compact Construction | |
| Sélectionner tout | ||
|---|---|---|
Marque Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Rectangular Alu with Fan | ||
Length 200mm | ||
Width 80 mm | ||
Height 83mm | ||
Finish Black Anodised | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Cooling | ||
Special Features Particularly Effective Heat Dissipation, Two Opposite Mounting Surfaces Are Milled Flat, Only Effective With Forced Ventilation by Means of the Fan but Not With Free Convection, Geometry of Hollow Fin Optimizing the Air Flow, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Compact Design With Axial Fan, With Air Flow Chamber, High Performance Density Due to Large Heat-Conducting Surfaces, Semiconductor Mounting Surface for Milled Flat, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Compact Construction | ||
- Pays d'origine :
- HU
Fischer Elektronik Cooling Aggregates with Axial Fans
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