Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 120 mm 150 mm 122 mm
- N° de stock RS:
- 692-0590
- Numéro d'article Distrelec:
- 304-11-271
- Référence fabricant:
- LA 17 150 230 V
- Fabricant:
- Fischer Elektronik
Sous-total (1 unité)*
547,86 €
(TVA exclue)
662,91 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
- 3 unité(s) prête(s) à être expédiée(s)
- Plus 2 unité(s) expédiée(s) à partir du 16 mars 2026
- Plus 2 unité(s) expédiée(s) à partir du 29 mai 2026
Unité | Prix par unité |
|---|---|
| 1 - 1 | 547,86 € |
| 2 - 4 | 532,61 € |
| 5 - 9 | 518,25 € |
| 10 + | 504,60 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 692-0590
- Numéro d'article Distrelec:
- 304-11-271
- Référence fabricant:
- LA 17 150 230 V
- Fabricant:
- Fischer Elektronik
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Fischer Elektronik | |
| For Use With | Universal Rectangular Alu with Fan | |
| Product Type | Heatsink | |
| Length | 150mm | |
| Width | 122 mm | |
| Height | 120mm | |
| Finish | Black Anodised | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Cooling | |
| Special Features | Extremely Low Losses Due to Optimised Hollow Fin Geometry, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Compact Construction, Compact Design With Axial Fan, Two Opposite Mounting Surfaces Are Milled Flat, High Performance Density Due to Large Heat-Conducting Surfaces, Geometry of Hollow Fin Optimizing the Air Flow, Semiconductor Mounting Surface for Milled Flat, With Air Flow Chamber, Only Effective With Forced Ventilation by Means of the Fan but Not With Free Convection, Particularly Effective Heat Dissipation | |
| Sélectionner tout | ||
|---|---|---|
Marque Fischer Elektronik | ||
For Use With Universal Rectangular Alu with Fan | ||
Product Type Heatsink | ||
Length 150mm | ||
Width 122 mm | ||
Height 120mm | ||
Finish Black Anodised | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Cooling | ||
Special Features Extremely Low Losses Due to Optimised Hollow Fin Geometry, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Compact Construction, Compact Design With Axial Fan, Two Opposite Mounting Surfaces Are Milled Flat, High Performance Density Due to Large Heat-Conducting Surfaces, Geometry of Hollow Fin Optimizing the Air Flow, Semiconductor Mounting Surface for Milled Flat, With Air Flow Chamber, Only Effective With Forced Ventilation by Means of the Fan but Not With Free Convection, Particularly Effective Heat Dissipation | ||
- Pays d'origine :
- CN
Fischer Elektronik Cooling Aggregates with Axial Fans
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