Fischer Elektronik Heatsink, Universal Round Alu, 4.25°C/W 18.5 mm
- N° de stock RS:
- 674-4832
- Référence fabricant:
- ICK S R 28,5x18,5
- Fabricant:
- Fischer Elektronik
Sous-total (1 unité)*
10,82 €
(TVA exclue)
13,09 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
- 2 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
- Plus 28 unité(s) expédiée(s) à partir du 16 mars 2026
Unité | Prix par unité |
|---|---|
| 1 - 9 | 10,82 € |
| 10 - 24 | 9,96 € |
| 25 - 49 | 9,54 € |
| 50 - 99 | 9,20 € |
| 100 + | 8,45 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 674-4832
- Référence fabricant:
- ICK S R 28,5x18,5
- Fabricant:
- Fischer Elektronik
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Round Alu | |
| Height | 18.5mm | |
| Thermal Resistance | 4.25°C/W | |
| Fastening | Clamp, Glue, Integrated clamp, Screw | |
| Diameter | 28.5 mm | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PLCC, DIL/IC, PGA, BGA, LED, SMD | |
| Standards/Approvals | No | |
| Material | Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil | |
| Application | Heat Sink For Pentium II Mobile Module, Heat Sink For IC, Heat Sink For Power PC, Heat Sink For Microprocessor, Heat Sink For Pentium III/Xeon, Heat Sink For Dil and Ic, Heat Sink For PLCC, Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, SMD, Cooler, Heatsink for PGA | |
| Special Features | Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry and Black Anodised Surface, or Thermally Conductive Glue, Easy Mounting Using Fixing Clamp, Thermally Conductive Adhesive Foil, Fan Motors With Other Operating Voltages on Request, Compact Design With High Mechanical Stability, Special High-Grade Industrial Type, Components Fastened Using Glue, Custom-specific Modifications and Special Designs, or Clamps, Double Ball Bearings in Fan Motor Axle for High Reliability and Long Product Life, Low Weight by Optimised Geometry, Low Current Consumption and Thus Low Self-Heating, Other Pin Lengths and Surfaces on Request, Effective Heat Dissipation by Optimum Design of Fan Motor and Heatsink, Adhesive Foil, Fan Motors Also Available With Pulse Output and Alarm Device Circuit | |
| Sélectionner tout | ||
|---|---|---|
Marque Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Round Alu | ||
Height 18.5mm | ||
Thermal Resistance 4.25°C/W | ||
Fastening Clamp, Glue, Integrated clamp, Screw | ||
Diameter 28.5 mm | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PLCC, DIL/IC, PGA, BGA, LED, SMD | ||
Standards/Approvals No | ||
Material Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil | ||
Application Heat Sink For Pentium II Mobile Module, Heat Sink For IC, Heat Sink For Power PC, Heat Sink For Microprocessor, Heat Sink For Pentium III/Xeon, Heat Sink For Dil and Ic, Heat Sink For PLCC, Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, SMD, Cooler, Heatsink for PGA | ||
Special Features Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry and Black Anodised Surface, or Thermally Conductive Glue, Easy Mounting Using Fixing Clamp, Thermally Conductive Adhesive Foil, Fan Motors With Other Operating Voltages on Request, Compact Design With High Mechanical Stability, Special High-Grade Industrial Type, Components Fastened Using Glue, Custom-specific Modifications and Special Designs, or Clamps, Double Ball Bearings in Fan Motor Axle for High Reliability and Long Product Life, Low Weight by Optimised Geometry, Low Current Consumption and Thus Low Self-Heating, Other Pin Lengths and Surfaces on Request, Effective Heat Dissipation by Optimum Design of Fan Motor and Heatsink, Adhesive Foil, Fan Motors Also Available With Pulse Output and Alarm Device Circuit | ||
- Pays d'origine :
- DE

ICK S R Series
PGA Heatsinks
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