SPREADFAST Heatsink, Universal Square Ceramic, 15.7°C/W, 26.7 °C/W 6 mm 32 mm 32mm
- N° de stock RS:
- 123-5619
- Référence fabricant:
- SF-CHS-323206P
- Fabricant:
- SPREADFAST
Offre groupée disponible
Sous-total (1 paquet de 5 unités)*
12,46 €
(TVA exclue)
15,075 €
(TVA incluse)
Informations sur le stock actuellement non accessibles - Veuillez vérifier plus tard
Unité | Prix par unité | le paquet* |
|---|---|---|
| 5 - 45 | 2,492 € | 12,46 € |
| 50 - 120 | 2,288 € | 11,44 € |
| 125 - 245 | 2,194 € | 10,97 € |
| 250 - 495 | 2,118 € | 10,59 € |
| 500 + | 1,94 € | 9,70 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 123-5619
- Référence fabricant:
- SF-CHS-323206P
- Fabricant:
- SPREADFAST
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | SPREADFAST | |
| Product Type | Heatsink | |
| For Use With | Universal Square Ceramic | |
| Length | 32mm | |
| Width | 32mm | |
| Height | 6mm | |
| Fastening | Adhesive, Screw | |
| Thermal Resistance | 15.7, 26.7°C/W | |
| Series | Pin Fin | |
| Colour | White | |
| Standards/Approvals | RoHS | |
| Material | Aluminium Oxide | |
| Sélectionner tout | ||
|---|---|---|
Marque SPREADFAST | ||
Product Type Heatsink | ||
For Use With Universal Square Ceramic | ||
Length 32mm | ||
Width 32mm | ||
Height 6mm | ||
Fastening Adhesive, Screw | ||
Thermal Resistance 15.7, 26.7°C/W | ||
Series Pin Fin | ||
Colour White | ||
Standards/Approvals RoHS | ||
Material Aluminium Oxide | ||
- Pays d'origine :
- CN
Spreadfast SF-CHS Series Square Pin Ceramic Heatsink
Spreadfast SF-CHS series of square pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
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