TE Connectivity Heatsink, XFP Cages
- N° de stock RS:
- 468-874
- Numéro d'article Distrelec:
- 304-55-507
- Référence fabricant:
- 2170488-8
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 12 unités)*
182,76 €
(TVA exclue)
221,14 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 29 juin 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 182,76 € | 15,23 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 468-874
- Numéro d'article Distrelec:
- 304-55-507
- Référence fabricant:
- 2170488-8
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| For Use With | XFP Cages | |
| Product Type | Heatsink | |
| Series | XFP | |
| Finish | Nickel | |
| Standards/Approvals | 2016, EU ELV 2000/53/EC, EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32 | |
| Material | Aluminium | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
For Use With XFP Cages | ||
Product Type Heatsink | ||
Series XFP | ||
Finish Nickel | ||
Standards/Approvals 2016, EU ELV 2000/53/EC, EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32 | ||
Material Aluminium | ||
- Pays d'origine :
- CN
The TE Connectivity Heat Sink is meticulously designed to optimise cooling for high-performance applications. Ideal for use with XFP devices, this product features a pin fin configuration with 60 fins to ensure superior heat dissipation. Crafted from durable aluminium and finished with nickel plating, it not only guarantees reliability but also enhances the overall aesthetic of your setup. Specifically engineered to meet stringent compliance standards, this heat sink is an excellent choice for demanding environments. Whether you are looking to boost device efficiency or improve thermal management, this product stands out with its robust construction and thoughtful design tailored for modern connectivity solutions.
Optimised for high-performance XFP device cooling
Constructed from lightweight yet sturdy aluminium material
Nickel plating enhances corrosion resistance and longevity
Pin fin design maximises airflow, ensuring efficient heat dissipation
Compliant with EU RoHS and ELV directives for safety and environmental standards
Compatible with various connectors and accessories for versatile applications
Ensures reliable performance in demanding electronic environments
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