Transcend M.2 2 TB Internal SSD

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1 431,93 €

(TVA exclue)

1 732,64 €

(TVA incluse)

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*Prix donné à titre indicatif

N° de stock RS:
683-006
Référence fabricant:
TS2TMTE760T
Fabricant:
Transcend
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Marque

Transcend

Memory Size

2TB

Product Type

SSD

Sub Type

SSD

Internal/External

Internal

Form Factor

M.2

Industrial Grade

Yes

NAND Type

3D

Interface Type

NVMe PCIe Gen 4 x4

Encryption Level

256 Bit AES Encryption

Maximum Operating Temperature

75°C

Minimum Operating Temperature

-20°C

Standards/Approvals

UKCA

Length

80mm

Height

2.23mm

Width

22mm

Transcend SSD, 2TB Memory size, NVMe PCIe Gen 4 x4 Interface Type - TS2TMTE760T


This SSD is an internal storage device designed for high-performance NVMe applications in industrial settings. It connects via a PCIe Gen4 x4 Interface in an M.2 form factor and is intended for use where compact, high-capacity flash storage is required under demanding environmental conditions.

Features and Benefits:


• 2TB capacity enables large dataset and image storage
• NVMe PCIe Gen4 x4 provides high-throughput transfer rates
• 3D NAND offers increased storage density for longevity
• 256-bit AES encryption secures stored data at rest
• Industrial-grade design tolerates extreme operational stress
• Operating range from -20°C to 75°C supports harsh environments

Applications


• Suitable for embedded automation controllers requiring local mass storage
• Ideal for data logging in electrical test rigs and instrumentation
• Used with industrial PCs in manufacturing process control
• Can be used for onboard storage in robotics and motion systems
• Suitable for edge computing in remote monitoring installations

What physical footprint does it occupy for board layout planning?


It uses the M.2 2280 footprint with a width of 22mm and a length of 80 mm, enabling Compact placement on compatible carrier boards.

How does it handle elevated junction temperatures during sustained workloads?


The device is rated to operate up to a maximum temperature of 75°C, supporting continuous operation in thermally challenging locations.

Is it suitable for integration into sealed electrical enclosures?


Yes, its industrial grading and temperature tolerance make it appropriate for enclosed equipment where ambient conditions can vary.

Which NAND architecture is employed and what is the impact on endurance?


It uses 3D NAND, which increases cell stacking for higher density and contributes to improved programme/erase endurance profiles compared with Planar NAND.

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