TE Connectivity 3.5 mm Grounding Contact

Sous-total (1 bobine de 2000 unités)*

811,69 €

(TVA exclue)

982,14 €

(TVA incluse)

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  • Prêt à être expédié à partir du 23 octobre 2026
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Bobine(s)
la bobine
Prix par unité*
1 +811,69 €0,406 €

*Prix donné à titre indicatif

N° de stock RS:
467-193
Numéro d'article Distrelec:
304-51-530
Référence fabricant:
1447009-8
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Material

Copper

Product Type

Grounding Contact

Fixing Method

Clip-On

Current

1.5A

Contact Plating

Gold

Height

3.5mm

Standards/Approvals

EU RoHS Directive 2011/65/EU Compliant, 2016, EU ELV Directive 2000/53/EC Compliant, EU REACH Regulation (EC) No. 1907/2006, China RoHS 2 Directive MIIT Order No 32

Pays d'origine :
CN
The TE Connectivity C-Clip PCB Spring Contact is engineered to deliver reliable connectivity with an uncompressed height of 3.5 mm and an optimal working range designed for low-profile applications. Ideal for board-to-board connector systems, this product ensures exceptional performance in signal circuit applications. With its robust construction from high-quality materials, it offers not only durability but also a sophisticated design that integrates effortlessly into a range of electronic devices. The precision engineering enhances contact reliability, making it an essential component for modern electronic solutions. The combination of nickel plating and gold contact areas supports both excellent electrical conductivity and resistance to corrosion, furthering its utility in demanding environments. This product represents a commitment to quality and innovation, providing an optimal solution for connectivity in various applications.

C-Clip design offers secure contact retention

Accommodates a range of thermal conditions with a wide operating temperature

Constructed from premium materials for enhanced durability

Designed for ease of integration in printed circuit board layouts

Provides a current rating that meets the demands of various applications

Available in tape and reel packaging for efficient handling and installation

Compliant with EU RoHS and REACH regulations, ensuring environmental safety

Supports automated assembly processes with reflow solder capability

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