Infineon 2EDL23N06PJXUMA1 MOSFET Gate Driver 2, 2.3 A 14-Pin 17.5V, DSO

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N° de stock RS:
897-7507
Référence fabricant:
2EDL23N06PJXUMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Output Current

2.3A

Pin Count

14

Package Type

DSO

Fall Time

60ns

Driver Type

MOSFET

Rise Time

80ns

Minimum Supply Voltage

17.5V

Maximum Supply Voltage

17.5V

Number of Drivers

2

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

150°C

Standards/Approvals

No

Series

2EDL23N06PJ

Height

1.25mm

Length

8.75mm

Mount Type

Surface

Automotive Standard

No

Infineon 2EDL23N06PJ Series MOSFET, 17.5V Maximum Supply Voltage, 2.3A Output Current - 2EDL23N06PJXUMA1


This MOSFET is a dual-output semiconductor driver designed for switching and power-management roles in compact electronic assemblies. It operates within a low-voltage supply envelope and is provided as a surface-mount device in a 14-pin DSO package, offering a small footprint for board-level integration. The component is specified for operation across a wide temperature span, making it suitable for applications requiring stable switching under elevated thermal conditions.

Features and Benefits:


• Dual-driver configuration delivers two independent outputs for flexible control
• Output current capability of 2.3A supports moderate power loads
• Maximum supply rating of 17.5V enables low-voltage system compatibility
• Rise time of 80 ns promotes rapid turn-on for efficient switching
• Fall time of 60 ns ensures swift turn-off to reduce switching losses
• Operating range from -40 °C to 150 °C tolerates harsh thermal environments

Applications


• Suitable for power-management stages in compact converters
• Ideal for gate-driving in dual-channel switch circuits
• Used with motor-control front ends requiring modest current
• Can be used for load switching in temperature-challenging systems
• Suitable for compact, space-constrained surface-mount designs

What mounting method is used for integration onto a board?


It is supplied as a surface-mount device in a 14-pin DSO package to allow reflow soldering and dense PCB layouts.

How compact is the component for space-limited designs?


The device presents a small package profile with a length of 8.75mm and width of 4mm, enabling tight component placement.

How many drivers and outputs does the device provide?


It contains two drivers and two outputs, allowing independent control of two channels.

What thermal extremes can it withstand during operation?


It is rated to operate down to -40 °C and up to 150 °C, supporting designs exposed to high ambient temperatures.

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