Infineon IR2010STRPBF MOSFET Gate Driver, 3 A 16-Pin 200V, SOIC

Sous-total (1 bobine de 1000 unités)*

1 797,00 €

(TVA exclue)

2 174,00 €

(TVA incluse)

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  • Expédition à partir du 26 février 2027
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la bobine*
1000 +1,797 €1 797,00 €

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N° de stock RS:
226-6147
Référence fabricant:
IR2010STRPBF
Fabricant:
Infineon
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Marque

Infineon

Product Type

Power MOSFET & IGBT Driver

Output Current

3A

Pin Count

16

Fall Time

25ns

Package Type

SOIC

Number of Outputs

2

Driver Type

MOSFET

Rise Time

10ns

Minimum Supply Voltage

10V

Maximum Supply Voltage

200V

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Series

IR2010(S)PBF

Standards/Approvals

No

Width

7.6mm

Length

10.5mm

Height

2.65mm

Mount Type

Surface

Automotive Standard

No

Infineon IR2010(S)PBF Series Power MOSFET & IGBT Driver, 10V Minimum Supply Voltage, 3A Output Current - IR2010STRPBF


This power MOSFET & IGBT driver is a dual-channel gate driver IC designed to drive power MOSFETs and IGBTs in high-voltage switching applications. It operates within industrial temperature extremes and supports use in surface-mounted assemblies, providing controlled gate drive currents and fast switching performance for power electronics systems.

Features and Benefits:


• Dual outputs deliver 3A Peak drive current for Faster switching
• 10V minimum supply enables operation from common gate rails
• 10ns rise time reduces transition losses during turn-on
• 25ns fall time limits switching stress on transistors
• 200V maximum supply provides high-voltage gate drive capability
• 16-pin SOIC package allows Compact surface mounting

Applications


• Suitable for gate driving in inverter power stages
• Ideal for high-voltage switch control in converters
• Used with discrete MOSFET arrays in motor drives
• Can be used for IGBT gate control in power supplies
• Suitable for Compact surface-mounted power modules

What temperature range can it operate within?


It functions across a wide ambient range from -55°C to 150°C, supporting deployment in thermally demanding environments.

What package and mounting style does it use?


The device is supplied in a 16-pin SOIC package intended for surface-mount assembly on PCBs.

How does its pin count affect PCB layout?


The 16-pin arrangement provides separate pins for dual outputs and control inputs, simplifying routing for isolated gate signals.

What physical profile should designers allow for height constraints?


The component has a total height of 2.65 mm, which should be considered when planning component stacking and enclosure clearances.

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