Kontakt Chemie 82009 Novolack Etching Chemical for Etching
- N° de stock RS:
- 173-886
- Numéro d'article Distrelec:
- 303-08-576
- Référence fabricant:
- 82009
- Fabricant:
- Kontakt Chemie
Sous-total (1 unité)*
26,55 €
(TVA exclue)
32,13 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
En stock
- 17 unité(s) prête(s) à être expédiée(s)
- Plus 42 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
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Unité | Prix par unité |
|---|---|
| 1 + | 26,55 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 173-886
- Numéro d'article Distrelec:
- 303-08-576
- Référence fabricant:
- 82009
- Fabricant:
- Kontakt Chemie
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Kontakt Chemie | |
| Process Type | Etching | |
| Product Type | Etching Chemical | |
| Material | Novolack | |
| Dispenser Type | Spray | |
| Standards/Approvals | RoHS | |
| Sélectionner tout | ||
|---|---|---|
Marque Kontakt Chemie | ||
Process Type Etching | ||
Product Type Etching Chemical | ||
Material Novolack | ||
Dispenser Type Spray | ||
Standards/Approvals RoHS | ||
- Pays d'origine :
- BE
CRC Etching Chemical, Liquid Ferric Chloride Form, Novolack - 82009
This etching chemical is a liquid photo-positive resist designed for use in PCB production. Made from a composition of Novolack and O-Naphto-Chinon-Diazide, it effectively transfers patterns onto various substrates. The sensitive formulation allows for high precision in chemical etching processes, ensuring that electrical circuits remain intact after application.
Features & Benefits
• Resists strong acidic etching while allowing easy removal
• Maximum photo-sensitivity in the UV-A wavelength range
• Designed for application in dark or yellow light settings
• Suitable for both metal and glass lithographic projects
• Ensures accurate pattern transfer on circuit boards
• Enables effective etching of copper and brass materials
Applications
• Utilised for printed circuit board production
• Applied in photo-lithographic processes on metals
• Suitable for glass etching
• Used in creating durable inscriptions or graphics
How should surfaces be prepared before application?
Surfaces must be cleaned of grease and oxides, ideally using a water-based cleaning process, with final rinses in deionised water to ensure full wettability.
What is the recommended drying process after coating?
Post-coating, boards should be dried in the dark, with temperatures gradually raised to 70°C and maintained for 15 minutes to ensure optimal film quality.
How is the developing process carried out after exposure?
The exposed plate should be immersed in a sodium hydroxide bath for approximately 60 seconds to dissolve the exposed lacquer, followed by thorough rinsing in water.
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