TE Connectivity 1544169-1 Series Edge Connector, Board, 2.54 mm Pitch, Solder
- N° de stock RS:
- 467-067
- Numéro d'article Distrelec:
- 304-49-358
- Référence fabricant:
- 1544169-1
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 33000 unités)*
523,30 €
(TVA exclue)
633,19 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 21 septembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 523,30 € | 0,016 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 467-067
- Numéro d'article Distrelec:
- 304-49-358
- Référence fabricant:
- 1544169-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | Edge Connector | |
| Pitch | 2.54mm | |
| Mount Type | Board | |
| Contact Plating | Pre Tin | |
| Contact Material | Phosphor Bronze | |
| Card Thickness | 1mm | |
| Termination Type | Solder | |
| Standards/Approvals | EU RoHS 2011/65/EU, EU ELV 2000/53/EC, China RoHS 2 MIIT Order No 32, 2016 | |
| Series | 1544169-1 | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type Edge Connector | ||
Pitch 2.54mm | ||
Mount Type Board | ||
Contact Plating Pre Tin | ||
Contact Material Phosphor Bronze | ||
Card Thickness 1mm | ||
Termination Type Solder | ||
Standards/Approvals EU RoHS 2011/65/EU, EU ELV 2000/53/EC, China RoHS 2 MIIT Order No 32, 2016 | ||
Series 1544169-1 | ||
- Pays d'origine :
- GB
The TE Connectivity dual-in-line leadframe connector combines superior design with versatility, making it an ideal choice for various electronic applications. Engineered with a pitch of 2.54 mm, it provides reliable interconnections in densely packed circuit boards. The pre-tinned leadframes ensure enhanced solderability and longevity, while its robust construction caters to demanding environments. Its right winding direction enables effortless integration into PCB layouts, promoting efficient assembly processes. This product stands out for its attention to detail, promising secure connections and optimum performance, ultimately contributing to the reliability and effectiveness of electronic systems.
Dual-in-line configuration enables space-efficient board layouts
Pre-tin plating ensures excellent soldering characteristics
Compatible with through-hole termination techniques
Designed for board-to-board connectivity to enhance system integration
Accommodates up to 1 mm thick PCBs for versatile applications
Constructed with phosphor bronze for improved conductivity
Features a standoff height of 2 mm, promoting optimal clearance
Offers a leadframe clip length of 1.25 mm to secure connections
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