E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A
- N° de stock RS:
- 615-4939
- Référence fabricant:
- POS-628-S035-55
- Fabricant:
- E-TEC
Visuel non contractuel
Offre groupée disponible
Sous-total (1 tube de 14 unités)*
216,09 €
(TVA exclue)
261,464 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 03 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | le tube* |
|---|---|---|
| 14 - 336 | 15,435 € | 216,09 € |
| 350 - 1036 | 14,965 € | 209,51 € |
| 1050 - 2786 | 14,527 € | 203,38 € |
| 2800 - 5586 | 14,111 € | 197,55 € |
| 5600 + | 13,718 € | 192,05 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 615-4939
- Référence fabricant:
- POS-628-S035-55
- Fabricant:
- E-TEC
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | E-TEC | |
| Number of Contacts | 28 | |
| Mounting Type | Through Hole | |
| Pin Type | Turned | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Open Frame | |
| Termination Method | Solder | |
| Contact Plating | Gold | |
| Current Rating | 1A | |
| Orientation | Vertical | |
| Contact Material | Beryllium Copper | |
| Housing Material | PBT | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
| Sélectionner tout | ||
|---|---|---|
Marque E-TEC | ||
Number of Contacts 28 | ||
Mounting Type Through Hole | ||
Pin Type Turned | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Open Frame | ||
Termination Method Solder | ||
Contact Plating Gold | ||
Current Rating 1A | ||
Orientation Vertical | ||
Contact Material Beryllium Copper | ||
Housing Material PBT | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
Discrete component sockets with gold-plated contacts
Sockets featuring gold-plated contacts for receiving various components in small hybrid circuits.
Glass fibre reinforced polyester insulation, open frame construction.
Juxtaposed sockets without throughput loss.
Liens connexes
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