TE Connectivity 2.54mm Pitch Straight 28 Way, Through Hole Ladder IC Dip Socket, 1A

Voir l’ensemble des DIL Sockets
Informations sur le stock actuellement non accessibles
N° de stock RS:
186-4889
Référence fabricant:
1-2199299-2
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Number of Contacts

28

Mounting Type

Through Hole

Pitch

2.54mm

Row Width

15.24mm

Frame Type

Ladder

Termination Method

Solder

Contact Plating

Tin

Current Rating

1A

Orientation

Straight

Length

35.56mm

Width

17.7mm

Depth

5.1mm

Dimensions

35.56 x 17.7 x 5.1mm

Maximum Operating Temperature

+105°C

Voltage Rating

250 V ac/dc

Housing Material

Glass Filled PBT, Thermoplastic

Minimum Operating Temperature

-40°C

Contact Material

Phosphor Bronze

Pays d'origine :
CN
Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, as well as a variety of plating options.

6 to 48 positions
Precision four-finger inner contacts or dual leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems

Liens connexes