TE Connectivity, 1-2199298 2.54mm Pitch Straight 14 Way, Through Hole Standard Pin Ladder IC Dip Socket, 1A

Sous-total (1 tube de 3400 unités)*

462,40 €

(TVA exclue)

561,00 €

(TVA incluse)

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Temporairement en rupture de stock
  • 3 400 unité(s) expédiée(s) à partir du 09 février 2026
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Unité
Prix par unité
le tube*
3400 +0,136 €462,40 €

*Prix donné à titre indicatif

N° de stock RS:
164-6099
Référence fabricant:
1-2199298-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Number of Contacts

14

Mounting Type

Through Hole

Pin Type

Standard

Pitch

2.54mm

Row Width

7.62mm

Frame Type

Ladder

Termination Method

Solder

Contact Plating

Tin over Nickel

Current Rating

1A

Orientation

Straight

Length

17.78mm

Width

10mm

Depth

5.1mm

Dimensions

17.78 x 10 x 5.1mm

Maximum Operating Temperature

+105°C

Voltage Rating

250 V ac/dc

Minimum Operating Temperature

-40°C

Series

1-2199298

Contact Material

Phosphor Bronze

Housing Material

Glass Filled PBT, Thermoplastic

Pays d'origine :
CN

TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket


DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.

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