TE Connectivity AMPLIMITE 37 Way Vertical 2.77 mm Pitch Board D-Sub Connector, with Mounting Hole Female
- N° de stock RS:
- 480-570
- Numéro d'article Distrelec:
- 304-48-688
- Référence fabricant:
- 1757828-4
- Fabricant:
- TE Connectivity
Sous-total (1 paquet de 5 unités)*
217,87 €
(TVA exclue)
263,62 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 21 septembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 217,87 € | 43,574 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 480-570
- Numéro d'article Distrelec:
- 304-48-688
- Référence fabricant:
- 1757828-4
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Number of Contacts | 37 | |
| Product Type | D-Sub Connector | |
| Orientation | Vertical | |
| Current | 5A | |
| Mount Type | Board | |
| Connector Gender | Female | |
| Connector Type D | Receptacle | |
| Mounting Hardware | Mounting Hole | |
| D-Sub Shell Size | 4 | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | EU RoHS Directive 2011/65/EU Compliant, 2016 No Restricted Materials Above Threshold, EU ELV Directive 2000/53/EC Compliant with Exemptions, EU REACH Regulation (EC) No. 1907/2006, China RoHS 2 Directive MIIT Order No 32 | |
| Series | AMPLIMITE | |
| Contact Material | Brass, Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Pitch | 2.77mm | |
| Contact Size | 20 | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Number of Contacts 37 | ||
Product Type D-Sub Connector | ||
Orientation Vertical | ||
Current 5A | ||
Mount Type Board | ||
Connector Gender Female | ||
Connector Type D Receptacle | ||
Mounting Hardware Mounting Hole | ||
D-Sub Shell Size 4 | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals EU RoHS Directive 2011/65/EU Compliant, 2016 No Restricted Materials Above Threshold, EU ELV Directive 2000/53/EC Compliant with Exemptions, EU REACH Regulation (EC) No. 1907/2006, China RoHS 2 Directive MIIT Order No 32 | ||
Series AMPLIMITE | ||
Contact Material Brass, Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Pitch 2.77mm | ||
Contact Size 20 | ||
- Pays d'origine :
- MX
The TE Connectivity receptacle for cable-to-board connections is engineered for board mount applications where space is at a premium. With a sophisticated design that accommodates 37 positions, this product offers versatile connectivity options ideal for a variety of projects. The precision-engineered components ensure reliable performance in demanding environments, while the robust steel and zinc construction enhances durability. With a vertical PCB mount orientation, this socket-type receptacle not only meets but exceeds industry standards, making it an exceptional choice for today's technology-driven applications. Its compact size does not compromise on function, safeguarding signals within a temperature range of -55 to 125 °C. This is the perfect solution for efficient electrical connectivity, securing both performance and longevity.
Boasts a vertical mount orientation for streamlined installation on PCBs
Constructed with steel shells for added strength and reliability
Gold-plated contact mating area ensures optimal signal integrity
Offers a solder through-hole termination method for secure attachment
Designed to accommodate standard size 20 contacts for compatibility with various applications
Maintains performance even in extreme temperature environments
Configured with a suitable PCB mounting type to maximise space efficiency
Halogen-free materials contribute to environmentally friendly disposal
Supports soldering processes with a capability to withstand high temperatures
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